CHINA SYSTEM · OPERATING LOGIC
Read the concept through its operating structure
Training and inference value chips differently
Training values multi-chip interconnect, bandwidth and stability; inference values latency, concurrency, power and cost. Peak compute does not equal model throughput.
Memory and interconnect feed the accelerator
HBM, cache, network, optics and switches must move weights and tokens on time. The competitive unit is the board, rack and cluster.
Advanced packaging is performance design
Chiplets, 2.5D/3D stacking, interposers and substrates improve yield and distance but add thermal, warpage, test and capacity bottlenecks.
China targets the full integrated-circuit chain
China links design, fabrication, packaging/test, tools, materials, software and talent; its AI+ manufacturing action adds coordinated training, inference and edge deployment.
Korea should extend memory strength into system deals
Korea should integrate memory, substrates, tools and materials with accelerator, networking, cooling and software validation, while contracting end use, controls, IP, qualification and minimum purchases.